Friday, August 2, 2013

Interfacing with SideConnect Technology

The patent pending SideConnect technology simplifies the microfluidic chip/cartridge design. Microfluidic access is provided on the edge of the chip at the bonding interface between top and bottom wafer (side connection), thus avoiding additional processing like hole drilling or powder blasting of the top layer. This reduces production costs. Moreover, the functional area of a chip can be significantly reduced due to the smaller footprint of the design (only channels). The microfluidic chip can be side connected to a plastic cartridge either in a 2D (in-plane) or a 3D (out-of-plane) configuration.

The 2D version results in a slim assembly, which is easily accessible for optical applications.
The 3D version contains top reservoirs that can be easily integrated into a surrounding cartridge and accessed for pipetting a defined volume of sample, buffer or reagent.


This SideConnect technology has already proven to be compatible with applications like capillary electrophoresis, but the chip-cartridge design can basically be customized to any specific application. Currently, new SideConnect disposable lab-on-chip products are being developed for use in several Point-of-Care applications.


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